| 6713381 |
Method of forming semiconductor device including interconnect barrier layers |
Alexander L. Barr, Suresh Venkatesan, David B. Clegg, Rebecca G. Cole, Olubunmi O. Adetutu +5 more |
2004-03-30 |
| 6689680 |
Semiconductor device and method of formation |
— |
2004-02-10 |
| 6451681 |
Method of forming copper interconnection utilizing aluminum capping film |
— |
2002-09-17 |
| 6346469 |
Semiconductor device and a process for forming the semiconductor device |
— |
2002-02-12 |
| 6117759 |
Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package |
David B. Clegg, Terry Burnette |
2000-09-12 |
| 6107180 |
Method for forming interconnect bumps on a semiconductor die |
Robert A. Munroe |
2000-08-22 |
| 5597737 |
Method for testing and burning-in a semiconductor wafer |
Joel P. Dietz, Aubrey K. Sparkman |
1997-01-28 |
| 5470787 |
Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same |
— |
1995-11-28 |
| 5468655 |
Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules |
— |
1995-11-21 |
| 5104695 |
Method and apparatus for vapor deposition of material onto a substrate |
Eric Ernest Millham, Adolf E. Wirsing |
1992-04-14 |
| 4861425 |
Lift-off process for terminal metals |
Robert Howard |
1989-08-29 |
| 4602271 |
Personalizable masterslice substrate for semiconductor chips |
William E. Dougherty, Jr., William J. Nestork, William T. Norris |
1986-07-22 |
| 4598470 |
Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate |
William E. Dougherty, Jr., Robert W. Sargent |
1986-07-08 |
| 4202007 |
Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers |
William E. Dougherty, Jr. |
1980-05-06 |
