Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713381 | Method of forming semiconductor device including interconnect barrier layers | Alexander L. Barr, Suresh Venkatesan, David B. Clegg, Rebecca G. Cole, Olubunmi O. Adetutu +5 more | 2004-03-30 |
| 6689680 | Semiconductor device and method of formation | — | 2004-02-10 |
| 6451681 | Method of forming copper interconnection utilizing aluminum capping film | — | 2002-09-17 |
| 6346469 | Semiconductor device and a process for forming the semiconductor device | — | 2002-02-12 |
| 6117759 | Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package | David B. Clegg, Terry Burnette | 2000-09-12 |
| 6107180 | Method for forming interconnect bumps on a semiconductor die | Robert A. Munroe | 2000-08-22 |
| 5597737 | Method for testing and burning-in a semiconductor wafer | Joel P. Dietz, Aubrey K. Sparkman | 1997-01-28 |
| 5470787 | Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same | — | 1995-11-28 |
| 5468655 | Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules | — | 1995-11-21 |
| 5104695 | Method and apparatus for vapor deposition of material onto a substrate | Eric Ernest Millham, Adolf E. Wirsing | 1992-04-14 |
| 4861425 | Lift-off process for terminal metals | Robert Howard | 1989-08-29 |
| 4602271 | Personalizable masterslice substrate for semiconductor chips | William E. Dougherty, Jr., William J. Nestork, William T. Norris | 1986-07-22 |
| 4598470 | Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate | William E. Dougherty, Jr., Robert W. Sargent | 1986-07-08 |
| 4202007 | Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers | William E. Dougherty, Jr. | 1980-05-06 |