Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5160987 | Three-dimensional semiconductor structures formed from planar layers | Wilber D. Pricer, Thomas B. Faure, Bernard S. Meyerson, John R. Turnbull, Jr. | 1992-11-03 |
| 4899208 | Power distribution for full wafer package | Hans E. Dietsch | 1990-02-06 |
| 4602271 | Personalizable masterslice substrate for semiconductor chips | William E. Dougherty, Jr., Stuart E. Greer, William T. Norris | 1986-07-22 |