HD

Hans E. Dietsch

IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #3,895,440 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
4899208 Power distribution for full wafer package William J. Nestork 1990-02-06