Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lift-off process for terminal metals

Lift-off process for terminal metals

US Patent 4861425 · Granted Aug 29, 1989

Estimated economic value: $11,671,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of forming semiconductor device including interconnect barrier layers2004
Semiconductor device and method of formation2004
Method of forming copper interconnection utilizing aluminum capping film2002
Semiconductor device and a process for forming the semiconductor device2002
Method for multiplexed joining of solder bumps to various substrates during asse2000
Method for forming interconnect bumps on a semiconductor die2000
Composition for treatment of lead containing surface coatings and soil2000
Composition and method for treatment of lead-containing surface coatings and soi1999
Methods for treatment of lead-containing surface coatings and soil1998
Method for testing and burning-in a semiconductor wafer1997
Semiconductor device solder bump having intrinsic potential for forming an exten1995
Method for forming a temporary attachment between a semiconductor die and a subs1995