Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515034 | Bond pad having a trench and method for forming | Sohrab Safai, Tu-Anh N. Tran | 2016-12-06 |
| 9111755 | Bond pad and passivation layer having a gap and method for forming | Tu-Anh N. Tran, Sohrab Safai | 2015-08-18 |
| 6713381 | Method of forming semiconductor device including interconnect barrier layers | Alexander L. Barr, Suresh Venkatesan, Rebecca G. Cole, Olubunmi O. Adetutu, Stuart E. Greer +5 more | 2004-03-30 |
| 6117759 | Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package | Stuart E. Greer, Terry Burnette | 2000-09-12 |