Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325876 | Surface finish for wirebonding | Varughese Mathew, Burton J. Carpenter, Leo M. Higgins, III, Chu-Chung Lee | 2019-06-18 |
| 9780051 | Methods for forming semiconductor devices with stepped bond pads | Kurt H. Junker | 2017-10-03 |
| 9515034 | Bond pad having a trench and method for forming | Sohrab Safai, David B. Clegg | 2016-12-06 |
| 9437574 | Electronic component package and method for forming same | Chu-Chung Lee | 2016-09-06 |
| 9437459 | Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure | Burton J. Carpenter, Chu-Chung Lee | 2016-09-06 |
| 9368470 | Coated bonding wire and methods for bonding using same | Chu-Chung Lee, Burton J. Carpenter | 2016-06-14 |
| 9331046 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, James P. Johnston, Heng Keong Yip | 2016-05-03 |
| 9324675 | Structures for reducing corrosion in wire bonds | Burton J. Carpenter, Chu-Chung Lee | 2016-04-26 |
| 9257403 | Copper ball bond interface structure and formation | John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |
| 9111755 | Bond pad and passivation layer having a gap and method for forming | David B. Clegg, Sohrab Safai | 2015-08-18 |
| 8791582 | Integrated circuit package with voltage distributor | Chu-Chung Lee, Kian Leong Chin, Kevin J. Hess, Patrick Johnston, Heng Keong Yip | 2014-07-29 |
| 8556159 | Embedded electronic component | Burton J. Carpenter | 2013-10-15 |
| 8129226 | Power lead-on-chip ball grid array package | James P. Johnston, Chu-Chung Lee, James W. Miller, Kevin J. Hess | 2012-03-06 |
| 7808117 | Integrated circuit having pads and input/output (I/O) cells | Nhat Vo, Burton J. Carpenter, Dae Young Hong, James W. Miller, Kendall D. Phillips | 2010-10-05 |
| 7374971 | Semiconductor die edge reconditioning | Yuan Yuan, Kevin J. Hess, Chu-Chung Lee, Alan H. Woosley | 2008-05-20 |
| 7271013 | Semiconductor device having a bond pad and method therefor | Lois Yong, Peter R. Harper, Jeffrey W. Metz, George R. Leal, Dieu Van Dinh | 2007-09-18 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor | Susan H. Downey, Sheila F. Chopin, Peter R. Harper, Sohrab Safai, Alan H. Woosley | 2006-03-21 |
| 6998952 | Inductive device including bond wires | Yaping Zhou, Susan H. Downey, Sheila F. Chopin, Alan H. Woosley, Peter R. Harper +1 more | 2006-02-14 |
| 6937047 | Integrated circuit with test pad structure and method of testing | Richard K. Eguchi, Peter R. Harper, Chu-Chung Lee, William Williams, III, Lois Yong | 2005-08-30 |
| 6921979 | Semiconductor device having a bond pad and method therefor | Susan H. Downey, Peter R. Harper, Kevin J. Hess, Michael V. Leoni | 2005-07-26 |
| 6844631 | Semiconductor device having a bond pad and method therefor | Lois Yong, Peter R. Harper, Jeffrey W. Metz, George R. Leal, Dieu Dinh | 2005-01-18 |