Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600554 | Interconnection structures to improve signal integrity within stacked dies | Walker Joseph Turner, John M. Wilson | 2023-03-07 |
| 10685925 | Resistance and capacitance balancing systems and methods | Jim Dobbins, Sheetal Jain, Don Templeton, Wenjun Shi, Sunil Sudhakaran | 2020-06-16 |
| 10600730 | Cross talk reduction differential cross over routing systems and methods | Jim Dobbins, Sheetal Jain, Don Templeton, Wenjun Shi, Sunil Sudhakaran | 2020-03-24 |
| 9843511 | Method and apparatus for selecting path from paths between label edge routers | Cuihua Deng | 2017-12-12 |
| 9831198 | Inductors for integrated voltage regulators | Huabo Chen, Wenjie Mao | 2017-11-28 |
| 9306776 | Filtering high speed signals | Wenjie Mao, Huabo Chen, Mayan Riat | 2016-04-05 |
| 9270476 | Methods and apparatus for network protection | Junhui Liu | 2016-02-23 |
| 8791372 | Reducing impedance discontinuity in packages | Paul M. Harvey, Douglas O. Powell, Wolfgang Sauter | 2014-07-29 |
| 8742565 | Ball grid array with improved single-ended and differential signal performance | Roger D. Weekly | 2014-06-03 |
| 8440917 | Method and apparatus to reduce impedance discontinuity in packages | Paul M. Harvey, Douglas O. Powell, Wolfgang Sauter | 2013-05-14 |
| 8399981 | Ball grid array with improved single-ended and differential signal performance | Roger D. Weekly | 2013-03-19 |
| 8338948 | Ball grid array with improved single-ended and differential signal performance | Roger D. Weekly | 2012-12-25 |
| 8338949 | System to improve coreless package connections | Paul M. Harvey, Colm B. O'Reilly, Samuel W. Yang | 2012-12-25 |
| 8222739 | System to improve coreless package connections | Paul M. Harvey, Colm B. O'Reilly, Samuel W. Yang | 2012-07-17 |
| 8193800 | Voltage controlled on-chip decoupling capacitance to mitigate power supply noise | — | 2012-06-05 |
| 7256488 | Semiconductor package with crossing conductor assembly and method of manufacture | Chu-Chung Lee | 2007-08-14 |
| 7203608 | Impedane measurement of chip, package, and board power supply system using pseudo impulse response | Makoto Aikawa, Sang Hoo Dhong, Brian Flachs, Paul M. Harvey, Brad W. Michael | 2007-04-10 |
| 7049694 | Semiconductor package with crossing conductor assembly and method of manufacture | Chu-Chung Lee | 2006-05-23 |
| 6998952 | Inductive device including bond wires | Susan H. Downey, Sheila F. Chopin, Tu-Anh N. Tran, Alan H. Woosley, Peter R. Harper +1 more | 2006-02-14 |
| 6992377 | Semiconductor package with crossing conductor assembly and method of manufacture | Chu-Chung Lee | 2006-01-31 |
| 6933599 | Electromagnetic noise shielding in semiconductor packages using caged interconnect structures | Bennett A. Joiner, Ben W. Herberg | 2005-08-23 |