Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361985 | Thermally enhanced molded package for semiconductors | Yuan Yuan, Chuchung (Stephen) Lee | 2008-04-22 |
| 6933599 | Electromagnetic noise shielding in semiconductor packages using caged interconnect structures | Yaping Zhou, Ben W. Herberg | 2005-08-23 |
| 6847102 | Low profile semiconductor device having improved heat dissipation | Mark A. Gerber, Jose Antonio Montes De Oca, Trent Thompson | 2005-01-25 |
| 5734201 | Low profile semiconductor device with like-sized chip and mounting substrate | Frank Djennas, Wilhelm Sterlin | 1998-03-31 |
| 5683944 | Method of fabricating a thermally enhanced lead frame | Greg Ridsdale | 1997-11-04 |
| 5483098 | Drop-in heat sink package with window frame flag | — | 1996-01-09 |
| 5147821 | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation | Michael B. McShane, James J. Casto | 1992-09-15 |
| 5105259 | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation | Michael B. McShane, James J. Casto | 1992-04-14 |