Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361985 | Thermally enhanced molded package for semiconductors | Yuan Yuan, Bennett A. Joiner | 2008-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361985 | Thermally enhanced molded package for semiconductors | Yuan Yuan, Bennett A. Joiner | 2008-04-22 |