Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791157 | Integrated circuit package incorporating programmable elements | Qadeer A. Qureshi, Hugh William Boothby | 2004-09-14 |
| 6772356 | System for specifying core voltage for a microprocessor by selectively outputting one of a first, fixed and a second, variable voltage control settings from the microprocessor | Qadeer A. Qureshi, Charles W. Mitchell | 2004-08-03 |
| 6732266 | Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements | Charles Anderson, Alexander C. Tain | 2004-05-04 |
| 6449170 | Integrated circuit package incorporating camouflaged programmable elements | Quang D. Nguyen, Charles Anderson, Alexander C. Tain | 2002-09-10 |
| 5498767 | Method for positioning bond pads in a semiconductor die layout | Wyatt Huddleston | 1996-03-12 |
| 5455200 | Method for making a lead-on-chip semiconductor device having peripheral bond pads | Charles G. Bigler, Michael B. McShane, David D. Afshar | 1995-10-03 |
| 5381036 | Lead-on chip semiconductor device having peripheral bond pads | Charles G. Bigler, Michael B. McShane, David D. Afshar | 1995-01-10 |
| 5172214 | Leadless semiconductor device and method for making the same | — | 1992-12-15 |
| 5147815 | Method for fabricating a multichip semiconductor device having two interdigitated leadframes | — | 1992-09-15 |
| 5147821 | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation | Michael B. McShane, Bennett A. Joiner | 1992-09-15 |
| 5105259 | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation | Michael B. McShane, Bennett A. Joiner | 1992-04-14 |
| 5060052 | TAB bonded semiconductor device having off-chip power and ground distribution | Charles G. Bigler | 1991-10-22 |
| 5045914 | Plastic pad array electronic AC device | Michael B. McShane, Paul T. Lin | 1991-09-03 |
| 5014113 | Multiple layer lead frame | — | 1991-05-07 |
| 4924291 | Flagless semiconductor package | Israel A. Lesk, George W. Hawkins, Ronald E. Thomas, William L. Hunter, Michael B. McShane | 1990-05-08 |