Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227834 | Package grounding system | Karthik Chandrasekar, Ratnakar Dadi, Shawn Tzung-Sheng Lo, Emmanuel Atta, Subodh Yashwant Bhike | 2022-01-18 |
| 6732266 | Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements | Charles Anderson, James J. Casto | 2004-05-04 |
| 6581189 | Computer implemented method and program for automating flip-chip bump layout in integrated circuit package design | — | 2003-06-17 |
| 6569694 | Method of checking BGA substrate design | Pranabendra Sarma, Valerie Vivares | 2003-05-27 |
| 6449170 | Integrated circuit package incorporating camouflaged programmable elements | Quang D. Nguyen, Charles Anderson, James J. Casto | 2002-09-10 |
| 6417563 | Spring frame for protecting packaged electronic devices | Jonathan D. Halderman, Mohammad Khan, Tom Ley | 2002-07-09 |
| 6319752 | Single-layer autorouter | Joan L. Tan, Valerie Vivares | 2001-11-20 |
| 6229219 | Flip chip package compatible with multiple die footprints and method of assembling the same | Shrikar Bhagath | 2001-05-08 |
| 6041269 | Integrated circuit package verification | — | 2000-03-21 |
| 5608638 | Device and method for automation of a build sheet to manufacture a packaged integrated circuit | Georg Kuhnke, Kris Shih-Yen Chou | 1997-03-04 |