| 8405187 |
Chip package with channel stiffener frame |
Eric Tosaya, Jun Zhai, Chia-Ken Leong |
2013-03-26 |
| 8008133 |
Chip package with channel stiffener frame |
Eric Tosaya, Jun Zhai, Chia-Ken Leong |
2011-08-30 |
| 6512675 |
Heat sink grounded to a grounded package lid |
Thomas S. Tarter, Eric Tosaya, Shrikar Bhagath, Nhon T. Do |
2003-01-28 |
| 6417563 |
Spring frame for protecting packaged electronic devices |
Jonathan D. Halderman, Mohammad Khan, Alexander C. Tain |
2002-07-09 |
| 6362522 |
Cool frame for protecting packaged electronic devices |
— |
2002-03-26 |
| 5500555 |
Multi-layer semiconductor package substrate with thermally-conductive prepeg layer |
— |
1996-03-19 |
| 5249098 |
Semiconductor device package with solder bump electrical connections on an external surface of the package |
Michael D. Rostoker |
1993-09-28 |
| 5210683 |
Recessed chip capacitor wells with cleaning channels on integrated circuit packages |
— |
1993-05-11 |
