Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8405187 | Chip package with channel stiffener frame | Eric Tosaya, Jun Zhai, Chia-Ken Leong | 2013-03-26 |
| 8008133 | Chip package with channel stiffener frame | Eric Tosaya, Jun Zhai, Chia-Ken Leong | 2011-08-30 |
| 6512675 | Heat sink grounded to a grounded package lid | Thomas S. Tarter, Eric Tosaya, Shrikar Bhagath, Nhon T. Do | 2003-01-28 |
| 6417563 | Spring frame for protecting packaged electronic devices | Jonathan D. Halderman, Mohammad Khan, Alexander C. Tain | 2002-07-09 |
| 6362522 | Cool frame for protecting packaged electronic devices | — | 2002-03-26 |
| 5500555 | Multi-layer semiconductor package substrate with thermally-conductive prepeg layer | — | 1996-03-19 |
| 5249098 | Semiconductor device package with solder bump electrical connections on an external surface of the package | Michael D. Rostoker | 1993-09-28 |
| 5210683 | Recessed chip capacitor wells with cleaning channels on integrated circuit packages | — | 1993-05-11 |