Tom Ley — 8 Patents at AMD | Patent Leaderboard

Tom Ley has been granted 8 US patents while listed as an inventor at AMD. The first was granted in 1993 and the most recent in March 2013. Tom Ley ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Tom Ley in Santa Clara, CA, US.

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8405187	Chip package with channel stiffener frame	Eric Tosaya, Jun Zhai, Chia-Ken Leong	2013-03-26	$2,711,000
8008133	Chip package with channel stiffener frame	Eric Tosaya, Jun Zhai, Chia-Ken Leong	2011-08-30	$4,140,000
6512675	Heat sink grounded to a grounded package lid	Thomas S. Tarter, Eric Tosaya, Shrikar Bhagath, Nhon T. Do	2003-01-28	$2,528,000
6417563	Spring frame for protecting packaged electronic devices	Jonathan D. Halderman, Mohammad Khan, Alexander C. Tain	2002-07-09	$2,516,000
6362522	Cool frame for protecting packaged electronic devices	—	2002-03-26	$3,803,000
5500555	Multi-layer semiconductor package substrate with thermally-conductive prepeg layer	—	1996-03-19	$26,494,000
5249098	Semiconductor device package with solder bump electrical connections on an external surface of the package	Michael D. Rostoker	1993-09-28	$2,386,000
5210683	Recessed chip capacitor wells with cleaning channels on integrated circuit packages	—	1993-05-11	$6,823,000

Tom Ley — 8 Patents

Issued Patents All Time

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