Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068041 | Power reallocation for memory device | Dean M. Jenkins, Hedan Zhang, Bret Winkler, Ning Ye | 2024-08-20 |
| 11985782 | Enclosure fitting for electronic device | Bo Yang, Warren Middlekauff, Sean Lau, Ning Ye, Yangming Liu | 2024-05-14 |
| 11830849 | Semiconductor device with unbalanced die stackup | Saurabh Nilkanth Athavale, Pradeep Rai | 2023-11-28 |
| 11552040 | Package process, DAF replacement | Siqi Zhang, Xu Wang, Pradeep Rai | 2023-01-10 |
| 11551991 | Semiconductor device package having cover portion with curved surface profile | Bo Yang, Chun Sean Lau, Ning Ye | 2023-01-10 |
| 11094674 | Memory scaling semiconductor device | Nagesh Vodrahalli, Rama Shukla | 2021-08-17 |
| 11011500 | Memory scaling semiconductor device | Nagesh Vodrahalli, Chih Yang Li, Srinivasan Sivaram, Rama Shukla | 2021-05-18 |
| 10290354 | Partial memory die | Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Avinash Rajagiri, Shantanu Gupta +4 more | 2019-05-14 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Kim Lee Bock | 2018-11-13 |
| 9064836 | Extrinsic gettering on semiconductor devices | Chin-Tien Chiu, Yuang Zhang, Lu ZHONG, Kaiyou Qian | 2015-06-23 |
| 8852999 | System-in-a-package based flash memory card | Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson | 2014-10-07 |
| 8637978 | System-in-a-package based flash memory card | Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson | 2014-01-28 |
| 8575724 | Semiconductor device having under-filled die in a die stack | Hem Takiar | 2013-11-05 |
| 8470640 | Method of fabricating stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Cheemen Yu, Chih-Chin Liao | 2013-06-25 |
| 8432043 | Stacked wire bonded semiconductor package with low profile bond line | Hem Takiar | 2013-04-30 |
| 8294251 | Stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Cheemen Yu, Chih-Chin Liao | 2012-10-23 |
| 8241953 | Method of fabricating stacked wire bonded semiconductor package with low profile bond line | Hem Takiar | 2012-08-14 |
| 8022519 | System-in-a-package based flash memory card | Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson | 2011-09-20 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien +2 more | 2011-06-28 |
| 7816181 | Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby | Hem Takiar | 2010-10-19 |
| 7795715 | Leadframe based flash memory cards | Hem Takiar | 2010-09-14 |
| 7791191 | Semiconductor device having multiple die redistribution layer | Hem Takiar | 2010-09-07 |
| 7560304 | Method of making a semiconductor device having multiple die redistribution layer | Hem Takiar | 2009-07-14 |
| 7495255 | Test pads on flash memory cards | Hem Takiar | 2009-02-24 |
| 7488620 | Method of fabricating leadframe based flash memory cards including singulation by straight line cuts | Hem Takiar | 2009-02-10 |