Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12430274 | Processing core including integrated high capacity high bandwidth storage memory | Rama Shukla | 2025-09-30 |
| 12207569 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Biswajit Sur, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2025-01-21 |
| 11770982 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Biswajit Sur, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2023-09-26 |
| 11444062 | Memory scaling semiconductor device | — | 2022-09-13 |
| 11121301 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Biswajit Sur, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2021-09-14 |
| 11094674 | Memory scaling semiconductor device | Shrikar Bhagath, Rama Shukla | 2021-08-17 |
| 11011500 | Memory scaling semiconductor device | Shrikar Bhagath, Chih Yang Li, Srinivasan Sivaram, Rama Shukla | 2021-05-18 |
| 11004829 | Memory scaling semiconductor device | — | 2021-05-11 |
| 10985308 | Substrate materials for quantum processors | — | 2021-04-20 |
| 10811392 | TSV semiconductor device including two-dimensional shift | Toshiki Hirano, Vipin Ayanoor-Vitikkate | 2020-10-20 |
| 10535809 | Substrate materials for quantum processors | — | 2020-01-14 |
| 9870959 | Method and apparatus for testing a flip-chip assembly during manufacture | — | 2018-01-16 |
| 9201097 | Method and apparatus for testing integrated circuit die with a partially completed and validated module | — | 2015-12-01 |
| 9040348 | Electronic assembly apparatus and associated methods | Jon M. Long | 2015-05-26 |
| RE44629 | Process for assembling an integrated circuit package having a substrate vent hole | Suresh Ramalingam, Michael J. Costello, Mun Leong Loke, Ravi Mahajan | 2013-12-10 |
| 8057108 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Achintya Bhowmik, Gennady Farber, Hai Feng Liu, Hamid Eslampour, Ut Tran +3 more | 2011-11-15 |
| 7780360 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Achintya Bhowmik, Gennady Farber, Hai Feng Liu, Hamid Eslampour, Ut Tran +3 more | 2010-08-24 |
| 7401986 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Achintya Bhowmik, Gennady Farber, Hai Feng Liu, Hamid Eslampour, Ut Tran +3 more | 2008-07-22 |
| 7174060 | Ultra-thin polarization mode converters based on liquid crystal materials | Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi, Biswajit Sur | 2007-02-06 |
| 7099360 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Achintya Bhowmik, Gennady Farber, Hai Feng Liu, Hamid Eslampour, Ut Tran +3 more | 2006-08-29 |
| 7091063 | Electronic assembly comprising solderable thermal interface and methods of manufacture | Biswajit Sur, Thomas Workman | 2006-08-15 |
| 6982192 | High performance thermal interface curing process for organic flip chip packages | Biswajit Sur | 2006-01-03 |
| 6928200 | Ultra-thin polarization mode converters based on liquid crystal materials | Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi, Biswajit Sur | 2005-08-09 |
| 6879743 | Crystal-core fiber mode converter for low-loss polarization-insensitive planar lightwave circuits | Achintya Bhowmik | 2005-04-12 |
| 6860642 | Compact optical package with modular optical connector | Jaiom S. Sambyal, Biswajit Sur | 2005-03-01 |