| 9397016 |
Flip chip assembly process for ultra thin substrate and package on package assembly |
Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Kang Eu Ong, Sih Fei Lim +1 more |
2016-07-19 |
| 8847368 |
Flip chip assembly process for ultra thin substrate and package on package assembly |
Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Kang Eu Ong, Sih Fei Lim +1 more |
2014-09-30 |
| RE44629 |
Process for assembling an integrated circuit package having a substrate vent hole |
Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Ravi Mahajan |
2013-12-10 |
| 8258019 |
Flip chip assembly process for ultra thin substrate and package on package assembly |
Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Kang Eu Ong, Sih Fei Lim +1 more |
2012-09-04 |
| 7208342 |
Package warpage control |
Michael Lee, Soon Chuan Ong, Hooi Jin Teng, Lisa Lee, Altaf Hasan |
2007-04-24 |
| 6713366 |
Method of thinning a wafer utilizing a laminated reinforcing layer over the device side |
Weng Khoon Mong, Yew Cheong, Eng Chiang Gan |
2004-03-30 |
| 6490166 |
Integrated circuit package having a substrate vent hole |
Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Ravi Mahajan |
2002-12-03 |