Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7465368 | Die molding for flip chip molded matrix array package using UV curable tape | Szu Shing Lim, Sheou Hooi Lim | 2008-12-16 | $21,903,000 |
| 7210987 | Wafer grinding method | — | 2007-05-01 | $14,206,000 |
| 7179683 | Substrate grooves to reduce underfill fillet bridging | Al Ling Low, Yee Hao Ho, Wei Keat Loh | 2007-02-20 | $9,940,000 |
| 7172951 | Apparatus for controlled fracture substrate singulation | Oi Fong Chin, Weng Khoon Mong | 2007-02-06 | $13,917,000 |
| 7005317 | Controlled fracture substrate singulation | Oi Fong Chin, Weng Khoon Mong | 2006-02-28 | $11,249,000 |
| 6713366 | Method of thinning a wafer utilizing a laminated reinforcing layer over the device side | Weng Khoon Mong, Eng Chiang Gan, Mun Leong Loke | 2004-03-30 | $39,781,000 |