Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7465368 | Die molding for flip chip molded matrix array package using UV curable tape | Sheou Hooi Lim, Yew Cheong | 2008-12-16 |
| 7317257 | Inhibiting underfill flow using nanoparticles | Chun Hwa See | 2008-01-08 |