Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7465368 | Die molding for flip chip molded matrix array package using UV curable tape | Sheou Hooi Lim, Yew Cheong | 2008-12-16 | $21,903,000 |
| 7317257 | Inhibiting underfill flow using nanoparticles | Chun Hwa See | 2008-01-08 | $13,798,000 |