SL

Sheou Hooi Lim

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #3,372,784 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7465368 Die molding for flip chip molded matrix array package using UV curable tape Szu Shing Lim, Yew Cheong 2008-12-16