Weng Khoon Mong — 8 Patents at Intel

Weng Khoon Mong has been granted 8 US patents while listed as an inventor at Intel. The first was granted in 2004 and the most recent in November 2023. Weng Khoon Mong ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Weng Khoon Mong in Bukit Mertajam, MY.

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11817360	Chip scale package semiconductor device and method of manufacture	Loh Choong Keat, Edward Then	2023-11-14
10798814	SiP module and manufacturing method of the SiP module	Jing Cao, Dong-Feng Ling	2020-10-06
9397016	Flip chip assembly process for ultra thin substrate and package on package assembly	A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim +1 more	2016-07-19	$7,217,000
8847368	Flip chip assembly process for ultra thin substrate and package on package assembly	A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim +1 more	2014-09-30	$16,330,000
8258019	Flip chip assembly process for ultra thin substrate and package on package assembly	A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim +1 more	2012-09-04	$13,616,000
7172951	Apparatus for controlled fracture substrate singulation	Oi Fong Chin, Yew Cheong	2007-02-06	$13,917,000
7005317	Controlled fracture substrate singulation	Oi Fong Chin, Yew Cheong	2006-02-28	$11,249,000
6713366	Method of thinning a wafer utilizing a laminated reinforcing layer over the device side	Yew Cheong, Eng Chiang Gan, Mun Leong Loke	2004-03-30	$39,781,000

Weng Khoon Mong — 8 Patents

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