Weng Khoon Mong has been granted 8 US patents while listed as an inventor at Intel . The first was granted in 2004 and the most recent in November 2023. Weng Khoon Mong ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Weng Khoon Mong in Bukit Mertajam, MY.
Patents per Year Patents granted per year, 2004 to 2023 Bar chart with a peak of 1 patents in 2004. peak 1 2004: 1 patents 2004 2006: 1 patents 2006 2007: 1 patents 2007 2012: 1 patents 2012 2014: 1 patents 2014 2016: 1 patents 2016 2020: 1 patents 2020 2023: 1 patents 2023
Issued Patents All Time
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Showing 1–8 of 8 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
11817360 Chip scale package semiconductor device and method of manufacture Loh Choong Keat , Edward Then 2023-11-14
10798814 SiP module and manufacturing method of the SiP module Jing Cao , Dong-Feng Ling 2020-10-06
9397016 Flip chip assembly process for ultra thin substrate and package on package assembly A. Vethanayagam Rudge , Bok Sim Lim , Mun Leong Loke , Kang Eu Ong , Sih Fei Lim +1 more 2016-07-19
$7,217,000
8847368 Flip chip assembly process for ultra thin substrate and package on package assembly A. Vethanayagam Rudge , Bok Sim Lim , Mun Leong Loke , Kang Eu Ong , Sih Fei Lim +1 more 2014-09-30
$16,330,000
8258019 Flip chip assembly process for ultra thin substrate and package on package assembly A. Vethanayagam Rudge , Bok Sim Lim , Mun Leong Loke , Kang Eu Ong , Sih Fei Lim +1 more 2012-09-04
$13,616,000
7172951 Apparatus for controlled fracture substrate singulation Oi Fong Chin , Yew Cheong 2007-02-06
$13,917,000
7005317 Controlled fracture substrate singulation Oi Fong Chin , Yew Cheong 2006-02-28
$11,249,000
6713366 Method of thinning a wafer utilizing a laminated reinforcing layer over the device side Yew Cheong , Eng Chiang Gan , Mun Leong Loke 2004-03-30
$39,781,000
