Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879219 | Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure | Shaw Fong Wong, Wei Keat Loh, Au Seong Wong | 2020-12-29 |
| 9397016 | Flip chip assembly process for ultra thin substrate and package on package assembly | Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Sih Fei Lim +1 more | 2016-07-19 |
| 8847368 | Flip chip assembly process for ultra thin substrate and package on package assembly | Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Sih Fei Lim +1 more | 2014-09-30 |
| 8258019 | Flip chip assembly process for ultra thin substrate and package on package assembly | Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Sih Fei Lim +1 more | 2012-09-04 |