Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664257 | Contactless wafer separator | Varshalaxmi Bhatt Dhruvkumar, John Phillip Biggs | 2023-05-30 |
| 10879219 | Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure | Wei Keat Loh, Kang Eu Ong, Au Seong Wong | 2020-12-29 |