Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817360 | Chip scale package semiconductor device and method of manufacture | Loh Choong Keat, Weng Khoon Mong | 2023-11-14 |
| 9196504 | Thermal leadless array package with die attach pad locking feature | Albert Loh, Serafin P. Pedron, Jr., Saravuth Sirinorakul | 2015-11-24 |
| 7262077 | Capillary underfill and mold encapsulation method and apparatus | Yin Lai, Choong Kooi Chee, Cheong Ng, Mun Low | 2007-08-28 |