Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381280 | Semiconductor packages and methods for forming semiconductor package | Nathapong Suthiwongsunthorn, John Ducyao Beleran | 2019-08-13 |
| 9613877 | Semiconductor packages and methods for forming semiconductor package | Nathapong Suthiwongsunthorn, John Ducyao Beleran | 2017-04-04 |
| 9305889 | Leadless integrated circuit package having standoff contacts and die attach pad | Kirk Powell, John R. McMillan, Adonis Fung | 2016-04-05 |
| 9196504 | Thermal leadless array package with die attach pad locking feature | Albert Loh, Edward Then, Saravuth Sirinorakul | 2015-11-24 |
| 8828801 | Leadless array plastic package with various IC packaging configurations | John R. McMillan, Kirk Powell, Adonis Fung | 2014-09-09 |
| 8736037 | Leadless integrated circuit package having standoff contacts and die attach pad | Kirk Powell, John R. McMillan, Adonis Fung | 2014-05-27 |
| 8486762 | Leadless array plastic package with various IC packaging configurations | John R. McMillan, Kirk Powell, Adonis Fung | 2013-07-16 |
| 7858443 | Leadless integrated circuit package having standoff contacts and die attach pad | Kirk Powell, John R. McMillan, Adonis Fung | 2010-12-28 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same | Neil McLellan, Leo M. Higgins, III, Kwok Cheung Tsang, Kin Pui Kwan | 2008-04-15 |
| 6940154 | Integrated circuit package and method of manufacturing the integrated circuit package | Neil McLellan, Lin Yee | 2005-09-06 |
| 6818980 | Stacked semiconductor package and method of manufacturing the same | — | 2004-11-16 |
| 6188130 | Exposed heat spreader with seal ring | German Ramirez | 2001-02-13 |
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Michael A. Raftery +3 more | 1999-03-02 |