Paul R. Hoffman — 60 Patents at Amkor Technology

Paul R. Hoffman has been granted 60 US patents while listed as an inventor at Amkor Technology. The first was granted in 1980 and the most recent in December 2025. Paul R. Hoffman ranks #38,820 of 4,157,543 US inventors in our database (top 0.93%). Patent records list Paul R. Hoffman in San Diego, CA, US.

Issued Patents All Time

Showing 1–25 of 60 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12500198	Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same	Robin M. Davis, Clifford Sandstrom, Timothy L. Olson	2025-12-16
12500197	Encapsulant-defined land grid array (LGA) package and method for making the same	Robin M. Davis, Craig Bishop, Clifford Sandstrom	2025-12-16
12469776	Semiconductor assembly comprising a 3D block and method of making the same	Timothy L. Olson, Craig Bishop, Robin M. Davis	2025-11-11
12424527	Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages	Timothy L. Olson, Clifford Sandstrom	2025-09-23
12424450	Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same	Craig Bishop, Andrew Hoetker, Ryan Sanden, Timothy L. Olson	2025-09-23
12362322	Method of making a fan-out semiconductor assembly with an intermediate carrier	Timothy L. Olson	2025-07-15
12300561	Fully molded structure with multi-height components comprising backside conductive material and method for making the same	Clifford Sandstrom, Robin Davis, Timothy L. Olson	2025-05-13
12259427	Thermal head comprising a plurality of adapters for independent thermal control of zones	Thomas P. Jones, Samer Kabbani, Chan See Jean	2025-03-25
12205881	Semiconductor assembly comprising a 3D block and method of making the same	Timothy L. Olson, Craig Bishop, Robin Davis	2025-01-21
12170261	Molded direct contact interconnect structure without capture pads and method for the same	Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom	2024-12-17
12062550	Molded direct contact interconnect substrate and methods of making same	Robin Davis, Timothy L. Olson	2024-08-13
11973051	Molded direct contact interconnect structure without capture pads and method for the same	Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom	2024-04-30
11828795	Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones	Thomas P. Jones, Samer Kabbani, Chan See Jean	2023-11-28
11796589	Thermal head for independent control of zones	Thomas P. Jones, Samer Kabbani, Chan See Jean	2023-10-24
11749534	Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same	Robin Davis, Clifford Sandstrom, Timothy L. Olson	2023-09-05
11693051	Thermal head for independent control of zones	Thomas P. Jones, Samer Kabbani, Chan See Jean	2023-07-04
11656272	Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones	Thomas P. Jones, Samer Kabbani, Chan See Jean	2023-05-23
7176062	Lead-frame method and assembly for interconnecting circuits within a circuit module	Jeffrey Alan Miks, Kenneth Kaskoun, Markus K. Liebhard, Donald C. Foster, Frederic Bertholio	2007-02-13	$32,319,000
7064009	Thermally enhanced chip scale lead on chip semiconductor package and method of making same	David McCann, Richard L. Groover	2006-06-20	$23,450,000
7045883	Thermally enhanced chip scale lead on chip semiconductor package and method of making same	David McCann, Richard L. Groover	2006-05-16	$6,607,000
6919631	Structures for improving heat dissipation in stacked semiconductor packages	David Zoba	2005-07-19	$7,418,000
6900527	Lead-frame method and assembly for interconnecting circuits within a circuit module	Jeffrey Alan Miks, Kenneth Kaskoun, Markus K. Liebhard, Donald C. Foster, Frederic Bertholio	2005-05-31	$12,269,000
6873032	Thermally enhanced chip scale lead on chip semiconductor package and method of making same	David McCann, Richard L. Groover	2005-03-29	$5,902,000
6759266	Quick sealing glass-lidded package fabrication method	—	2004-07-06	$8,355,000
6737750	Structures for improving heat dissipation in stacked semiconductor packages	David Zoba	2004-05-18	$25,410,000

12 3 Next »

Paul R. Hoffman — 60 Patents

Issued Patents All Time

Patent Widget