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Robin Davis — 11 Patents

DUDeca Technologies Usa: 9 patents #4 of 10Top 40%
Vancouver, WA: #211 of 1,812 inventorsTop 15%
Washington: #9,483 of 76,902 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Robin Davis has been granted 11 US patents while listed as an inventor at Deca Technologies Usa. The first was granted in 2009 and the most recent in May 2025. Robin Davis ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Robin Davis in Vancouver, WA, US.

Patents per Year

Patents granted per year, 2009 to 2025Bar chart with a peak of 4 patents in 2024.peak 42009: 1 patents20092022: 1 patents20222023: 3 patents20232024: 4 patents20242025: 2 patents2025

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12300561 Fully molded structure with multi-height components comprising backside conductive material and method for making the same Clifford Sandstrom, Paul R. Hoffman, Timothy L. Olson 2025-05-13
12205881 Semiconductor assembly comprising a 3D block and method of making the same Timothy L. Olson, Craig Bishop, Paul R. Hoffman 2025-01-21
12170261 Molded direct contact interconnect structure without capture pads and method for the same Timothy L. Olson, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman 2024-12-17
12062550 Molded direct contact interconnect substrate and methods of making same Timothy L. Olson, Paul R. Hoffman 2024-08-13
12057373 Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same Timothy L. Olson, Clifford Sandstrom, Craig Bishop 2024-08-06
11973051 Molded direct contact interconnect structure without capture pads and method for the same Timothy L. Olson, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman 2024-04-30
11749534 Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same Paul R. Hoffman, Clifford Sandstrom, Timothy L. Olson 2023-09-05
11728248 Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects Timothy L. Olson, Craig Bishop, Clifford Sandstrom 2023-08-15
11616003 Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects Timothy L. Olson, Clifford Sandstrom, Craig Bishop 2023-03-28
11302212 Device for teaching music performance through tactile pitch association and methods of use — 2022-04-12
7568704 Method of playing blackjack with a bonus bet David A. Davis 2009-08-04

Frequent Collaborators

Timothy L. Olson9 shared
Clifford Sandstrom7 shared
Paul R. Hoffman6 shared
Craig Bishop6 shared
David A. Davis1 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11