Craig Bishop — 37 Patents at Deca Technologies

Craig Bishop has been granted 37 US patents while listed as an inventor at Deca Technologies. The first was granted in 1993 and the most recent in December 2025. Craig Bishop ranks #88,321 of 4,157,543 US inventors in our database (top 2.1%). Patent records list Craig Bishop in Scottsdale, AZ, US.

Issued Patents All Time

Showing 1–25 of 37 patents

Patent #	Title	Co-Inventors	Date
12506102	Fully molded semiconductor structure with face mounted passives and method of making the same	Clifford Sandstrom, Benedict San Jose, Timothy L. Olson	2025-12-23
12500197	Encapsulant-defined land grid array (LGA) package and method for making the same	Robin M. Davis, Paul R. Hoffman, Clifford Sandstrom	2025-12-16
12469776	Semiconductor assembly comprising a 3D block and method of making the same	Timothy L. Olson, Robin M. Davis, Paul R. Hoffman	2025-11-11
12438065	Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects	Robin M. Davis, Timothy L. Olson, Clifford Sandstrom	2025-10-07
12424450	Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same	Andrew Hoetker, Ryan Sanden, Paul R. Hoffman, Timothy L. Olson	2025-09-23
12381154	Fully molded bridge interposer and method of making the same	Timothy L. Olson, Clifford Sandstrom	2025-08-05
12334396	Unit specific variable or adaptive metal fill and system and method for the same	David Ryan Bartling, Timothy L. Olson	2025-06-17
12261140	Stackable fully molded semiconductor structure with vertical interconnects	Timothy L. Olson, Edward Hudson	2025-03-25
12205881	Semiconductor assembly comprising a 3D block and method of making the same	Timothy L. Olson, Robin Davis, Paul R. Hoffman	2025-01-21
12170261	Molded direct contact interconnect structure without capture pads and method for the same	Robin Davis, Timothy L. Olson, Clifford Sandstrom, Paul R. Hoffman	2024-12-17
12057373	Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same	Timothy L. Olson, Clifford Sandstrom, Robin Davis	2024-08-06
11973051	Molded direct contact interconnect structure without capture pads and method for the same	Robin Davis, Timothy L. Olson, Clifford Sandstrom, Paul R. Hoffman	2024-04-30
11887862	Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL	David Ryan Bartling, Timothy L. Olson	2024-01-30
11791207	Unit specific variable or adaptive metal fill and system and method for the same	David Ryan Bartling, Timothy L. Olson	2023-10-17
11728248	Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects	Robin Davis, Timothy L. Olson, Clifford Sandstrom	2023-08-15
11664321	Multi-step high aspect ratio vertical interconnect and method of making the same	Clifford Sandstrom, Timothy L. Olson	2023-05-30
11616003	Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects	Timothy L. Olson, Clifford Sandstrom, Robin Davis	2023-03-28
11538759	Fully molded bridge interposer and method of making the same	Timothy L. Olson, Clifford Sandstrom	2022-12-27
11444051	Fully molded semiconductor structure with face mounted passives and method of making the same	Clifford Sandstrom, Benedict San Jose, Timothy L. Olson	2022-09-13
11056453	Stackable fully molded semiconductor structure with vertical interconnects	Timothy L. Olson, Edward Hudson	2021-07-06
10672624	Method of making fully molded peripheral package on package device	Christopher M. Scanlan, William Boyd Rogers	2020-06-02
10573601	Semiconductor device and method of unit specific progressive alignment	Christopher M. Scanlan	2020-02-25
10157803	Semiconductor device and method of unit specific progressive alignment	Christopher M. Scanlan	2018-12-18
10056304	Automated optical inspection of unit specific patterning	Vaibhav Joga Singh Bora, Christopher M. Scanlan, Timothy L. Olson	2018-08-21
10050004	Fully molded peripheral package on package device	Christopher M. Scanlan, William Boyd Rogers	2018-08-14

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Craig Bishop — 37 Patents

Issued Patents All Time

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