Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

US Patent 11887862 · Granted Jan 30, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fully molded semiconductor structure with face mounted passives and method of ma2025
Fully molded semiconductor structure with face mounted passives and method of ma2025
Encapsulant-defined land grid array (LGA) package and method for making the same2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect bu2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025
Embedded component interposer or substrate comprising displacement compensation 2025
Embedded component interposer or substrate comprising displacement compensation 2025
Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages2025
Fully molded bridge interposer and method of making the same2025