Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Paul R. Hoffman, Clifford Sandstrom | 2025-09-23 |
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Craig Bishop, Andrew Hoetker, Ryan Sanden, Paul R. Hoffman | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Craig Bishop, Clifford Sandstrom | 2025-08-05 |
| 12362322 | Method of making a fan-out semiconductor assembly with an intermediate carrier | Paul R. Hoffman | 2025-07-15 |
| 12334396 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Craig Bishop | 2025-06-17 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Clifford Sandstrom, Paul R. Hoffman, Robin Davis | 2025-05-13 |
| 12261140 | Stackable fully molded semiconductor structure with vertical interconnects | Edward Hudson, Craig Bishop | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Craig Bishop, Robin Davis, Paul R. Hoffman | 2025-01-21 |
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman | 2024-12-17 |
| 12062550 | Molded direct contact interconnect substrate and methods of making same | Robin Davis, Paul R. Hoffman | 2024-08-13 |
| 12057373 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same | Clifford Sandstrom, Craig Bishop, Robin Davis | 2024-08-06 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman | 2024-04-30 |
| 11887862 | Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL | Craig Bishop, David Ryan Bartling | 2024-01-30 |
| 11791207 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Craig Bishop | 2023-10-17 |
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Robin Davis, Paul R. Hoffman, Clifford Sandstrom | 2023-09-05 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Robin Davis, Craig Bishop, Clifford Sandstrom | 2023-08-15 |
| 11664321 | Multi-step high aspect ratio vertical interconnect and method of making the same | Clifford Sandstrom, Craig Bishop | 2023-05-30 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Clifford Sandstrom, Craig Bishop, Robin Davis | 2023-03-28 |
| 11538759 | Fully molded bridge interposer and method of making the same | Craig Bishop, Clifford Sandstrom | 2022-12-27 |
| 11444051 | Fully molded semiconductor structure with face mounted passives and method of making the same | Clifford Sandstrom, Benedict San Jose, Craig Bishop | 2022-09-13 |
| 11056453 | Stackable fully molded semiconductor structure with vertical interconnects | Edward Hudson, Craig Bishop | 2021-07-06 |
| 10818635 | Fully molded semiconductor package for power devices and method of making the same | Christopher M. Scanlan | 2020-10-27 |
| 10600652 | Semiconductor device processing method for material removal | William Boyd Rogers, Ferdinand Aldas | 2020-03-24 |
| 10373870 | Semiconductor device and method of packaging | Christopher M. Scanlan | 2019-08-06 |
| 10373902 | Fully molded miniaturized semiconductor module | Christopher M. Scanlan | 2019-08-06 |