Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

US Patent 11616003 · Granted Mar 28, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fully molded semiconductor structure with face mounted passives and method of ma2025
Fully molded semiconductor structure with face mounted passives and method of ma2025
Fully molded semiconductor structure with face mounted passives and method of ma2025
Encapsulant-defined land grid array (LGA) package and method for making the same2025
Encapsulant-defined land grid array (LGA) package and method for making the same2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect bu2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect bu2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025