Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374420 | Carrier based high volume system level testing of devices with pop structures | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Ira Leventhal | 2025-07-29 |
| 12345756 | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Rohan Gupte, Homayoun Rezai +2 more | 2025-07-01 |
| 12320841 | Wafer scale active thermal interposer for device testing | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan | 2025-06-03 |
| 12320852 | Passive carrier-based device delivery for slot-based high-volume semiconductor test system | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Ira Leventhal, Hiroki Ikeda +1 more | 2025-06-03 |
| 12259427 | Thermal head comprising a plurality of adapters for independent thermal control of zones | Thomas P. Jones, Chan See Jean, Paul R. Hoffman | 2025-03-25 |
| 12259428 | Multiplexed thermal control wafer and coldplate | Taneli Veistinen, Terry Sinclair Connacher, Sami Mikola, Thomas P. Jones, Ari Kuukkala | 2025-03-25 |
| 12216154 | Active thermal interposer device | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan +4 more | 2025-02-04 |
| 12203958 | Shielded socket and carrier for high-volume test of semiconductor devices | Karthik Ranganathan, Gilberto Oseguera, Ira Leventhal, Koji Miyauchi, Keith Schaub +3 more | 2025-01-21 |
| 12203979 | Multi-input multi-zone thermal control for device testing | Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Martin Fischer | 2025-01-21 |
| 12085609 | Thermal control wafer with integrated heating-sensing elements | Carl L. Ostrowski, Terry Sinclair Connacher, Enrique Aleman, Thomas P. Jones, Sorin Dinescu | 2024-09-10 |
| 12013432 | Thermal control wafer with integrated heating-sensing elements | Carl L. Ostrowski, Terry Sinclair Connacher, Enrique Aleman, Thomas P. Jones, Sorin Dinescu | 2024-06-18 |
| 12000885 | Multiplexed thermal control wafer and coldplate | Taneli Veistinen, Terry Sinclair Connacher, Sami Mikola, Thomas P. Jones, Ari Kuukkala | 2024-06-04 |
| 11940487 | Thermal solution for massively parallel testing | Kazuyuki Yamashita, Ikeda Hiroki, Ira Leventhal, Mohammad Ghazvini, Paul Ferrari +3 more | 2024-03-26 |
| 11852678 | Multi-input multi-zone thermal control for device testing | Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Martin Fischer | 2023-12-26 |
| 11846669 | Active thermal interposer device | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan +4 more | 2023-12-19 |
| 11841392 | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Rohan Gupte, Homayoun Rezai +2 more | 2023-12-12 |
| 11828795 | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones | Thomas P. Jones, Chan See Jean, Paul R. Hoffman | 2023-11-28 |
| 11821913 | Shielded socket and carrier for high-volume test of semiconductor devices | Karthik Ranganathan, Gilberto Oseguera, Ira Leventhal, Koji Miyauchi, Keith Schaub +3 more | 2023-11-21 |
| 11808812 | Passive carrier-based device delivery for slot-based high-volume semiconductor test system | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Ira Leventhal, Hiroki Ikeda +1 more | 2023-11-07 |
| 11796589 | Thermal head for independent control of zones | Thomas P. Jones, Chan See Jean, Paul R. Hoffman | 2023-10-24 |
| 11774492 | Test system including active thermal interposer device | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan +4 more | 2023-10-03 |
| 11754620 | DUT placement and handling for active thermal interposer device | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan +4 more | 2023-09-12 |
| 11742055 | Carrier based high volume system level testing of devices with pop structures | Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera, Ira Leventhal | 2023-08-29 |
| 11693051 | Thermal head for independent control of zones | Thomas P. Jones, Chan See Jean, Paul R. Hoffman | 2023-07-04 |
| 11674999 | Wafer scale active thermal interposer for device testing | Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan | 2023-06-13 |