Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191241 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2025-01-07 |
| 11088064 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2021-08-10 |
| 10418318 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2019-09-17 |
| 10224270 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2019-03-05 |
| 9462690 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2016-10-04 |
| 8536458 | Fine pitch copper pillar package and method | Robert Francis Darveaux, John McCormick, Louis W. Nicholls | 2013-09-17 |
| 7064009 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | Richard L. Groover, Paul R. Hoffman | 2006-06-20 |
| 7045883 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | Richard L. Groover, Paul R. Hoffman | 2006-05-16 |
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | Richard L. Groover, Paul R. Hoffman | 2005-03-29 |
| 6838309 | Flip-chip micromachine package using seal layer | — | 2005-01-04 |
| 6597059 | Thermally enhanced chip scale lead on chip semiconductor package | Richard L. Groover, Paul R. Hoffman | 2003-07-22 |