David McCann has been granted 11 US patents while listed as an inventor at Amkor Technology . The first was granted in 2003 and the most recent in January 2025. David McCann ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list David McCann in Chandler, AZ, US.
Patents per Year Patents granted per year, 2003 to 2025 Bar chart with a peak of 2 patents in 2005. peak 2 2003: 1 patents 2003 2005: 2 patents 2005 2006: 2 patents 2006 2013: 1 patents 2013 2016: 1 patents 2016 2019: 2 patents 2019 2021: 1 patents 2021 2025: 1 patents 2025
Issued Patents All Time
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Showing 1–11 of 11 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12191241 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2025-01-07
11088064 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2021-08-10
$35,490,000
10418318 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2019-09-17
10224270 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2019-03-05
$4,445,000
9462690 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2016-10-04
8536458 Fine pitch copper pillar package and method Robert Francis Darveaux , John McCormick , Louis W. Nicholls 2013-09-17
$1,468,000
7064009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same Richard L. Groover , Paul R. Hoffman 2006-06-20
$23,450,000
7045883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same Richard L. Groover , Paul R. Hoffman 2006-05-16
$6,607,000
6873032 Thermally enhanced chip scale lead on chip semiconductor package and method of making same Richard L. Groover , Paul R. Hoffman 2005-03-29
$5,902,000
6838309 Flip-chip micromachine package using seal layer — 2005-01-04
$16,849,000
6597059 Thermally enhanced chip scale lead on chip semiconductor package Richard L. Groover , Paul R. Hoffman 2003-07-22
$36,697,000