| 12191241 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2025-01-07 |
|
| 11088064 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2021-08-10 |
$35,490,000 |
| 10418318 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2019-09-17 |
|
| 10224270 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2019-03-05 |
$4,445,000 |
| 9462690 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2016-10-04 |
|
| 8786075 |
Electrical circuit with component-accommodating lid |
Jeffery Alan Miks |
2014-07-22 |
$15,217,000 |
| 8536458 |
Fine pitch copper pillar package and method |
Robert Francis Darveaux, David McCann, Louis W. Nicholls |
2013-09-17 |
$1,468,000 |
| 7041516 |
Multi chip module assembly |
Sarathy Rajagopalan, Kishor Desai, Maniam Alagaratnam |
2006-05-09 |
$2,316,000 |
| 6943446 |
Via construction for structural support |
Ivor G. Barber, Kumar Nagarajan |
2005-09-13 |
$4,621,000 |
| 6777314 |
Method of forming electrolytic contact pads including layers of copper, nickel, and gold |
Kishor Desai, Maniam Alagaratnam |
2004-08-17 |
$2,614,000 |
| 6706622 |
Bonding pad interface |
— |
2004-03-16 |
$6,885,000 |
| 6558978 |
Chip-over-chip integrated circuit package |
— |
2003-05-06 |
$3,280,000 |
| 6431432 |
Method for attaching solderballs by selectively oxidizing traces |
Kishor Desai |
2002-08-13 |
$4,311,000 |
| 6369448 |
Vertically integrated flip chip semiconductor package |
— |
2002-04-09 |
$7,941,000 |
| 6294840 |
Dual-thickness solder mask in integrated circuit package |
— |
2001-09-25 |
$25,066,000 |
| 6171888 |
Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same |
Brian Lynch |
2001-01-09 |
$19,577,000 |
| 6166434 |
Die clip assembly for semiconductor package |
Kishor Desai, Sunil A. Patel |
2000-12-26 |
$19,369,000 |
| 6008991 |
Electronic system including packaged integrated circuits with heat spreading standoff support members |
Emily Hawthorne |
1999-12-28 |
$21,471,000 |
| 6002171 |
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package |
Kishor Desai, Sunil A. Patel |
1999-12-14 |
$33,483,000 |
| 5909057 |
Integrated heat spreader/stiffener with apertures for semiconductor package |
Sunil A. Patel |
1999-06-01 |
$17,274,000 |
| 5898575 |
Support assembly for mounting an integrated circuit package on a surface |
Emily Hawthorne |
1999-04-27 |
$7,915,000 |
| 5854085 |
Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same |
Kurt Raab |
1998-12-29 |
$7,445,000 |
| 5831836 |
Power plane for semiconductor device |
Jon M. Long |
1998-11-03 |
$5,955,000 |
| 5801432 |
Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes |
Michael D. Rostoker, Kurt Raab |
1998-09-01 |
$3,914,000 |
| 5780924 |
Integrated circuit underfill reservoir |
— |
1998-07-14 |
$4,330,000 |