Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394699 | Semiconductor devices and methods of manufacturing semiconductor devices | Roger D. St. Amand | 2025-08-19 |
| 12191241 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2025-01-07 |
| 11876039 | Semiconductor devices and methods of manufacturing semiconductor devices | Roger D. St. Amand | 2024-01-16 |
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2022-11-01 |
| 11362027 | Semiconductor devices and methods of manufacturing semiconductor devices | Roger D. St. Amand | 2022-06-14 |
| 11088064 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2021-08-10 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2020-07-14 |
| 10418318 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2019-09-17 |
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2019-07-09 |
| 10224270 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2019-03-05 |
| 9721872 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2017-08-01 |
| 9462690 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2016-10-04 |
| 8536458 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2013-09-17 |
| 5864776 | Apparatus and method for detecting an error in the placement of a lead frame on a surface of a die mold | Waite R. Warren, Jr., John T. Cox | 1999-01-26 |
| 5788829 | Method and apparatus for controlling plating thickness of a workpiece | Swati V. Joshi, Robert R. Botts | 1998-08-04 |
| 5776327 | Method and apparatus using an anode basket for electroplating a workpiece | Robert R. Botts, Swati V. Joshi | 1998-07-07 |
| 5744013 | Anode basket for controlling plating thickness distribution | Robert R. Botts, Swati V. Joshi | 1998-04-28 |
| 5653860 | System for ultrasonic removal of air bubbles from the surface of an electroplated article | Waite R. Warren, Jr. | 1997-08-05 |