Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431445 | Methods related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2025-09-30 |
| 12191241 | Fine pitch copper pillar package and method | David McCann, John McCormick, Louis W. Nicholls | 2025-01-07 |
| 12033954 | Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same | Howard E. Chen, David Viveiros, Jr., Russ Alan Reisner | 2024-07-09 |
| 12009343 | Stackable package and method | Roger D. St. Amand, Vladimir Perelman | 2024-06-11 |
| 11974390 | Reduction of packaging substrate deformation | Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen | 2024-04-30 |
| 11961805 | Devices and methods related to dual-sided radio-frequency package with overmold structure | Howard E. Chen | 2024-04-16 |
| 11894323 | Devices related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2024-02-06 |
| 11765814 | Devices and methods related to nested filters | Ki Wook Lee, Takeshi Furusawa, Sundeep Nand Nangalia, Russ Alan Reisner, John C. Baldwin | 2023-09-19 |
| 11596056 | Methods and devices related to reduced packaging substrate deformation | Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen | 2023-02-28 |
| 11545405 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2023-01-03 |
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2022-11-01 |
| 11244835 | Control of under-fill using a film during fabrication for a dual-sided ball grid array package | Howard E. Chen, Hoang Mong Nguyen | 2022-02-08 |
| 11233014 | Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same | Howard E. Chen, David Viveiros, Jr., Russ Alan Reisner | 2022-01-25 |
| 11201066 | Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package | Bruce J. Freyman, Yi-Ling Liu | 2021-12-14 |
| 11190158 | Low frequency shield solutions with sputtered/sprayed absorber materials and/or absorber materials mixed in mold compound | Dinhphuoc Vu Hoang | 2021-11-30 |
| 11139257 | Methods related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2021-10-05 |
| 11127690 | Dual-sided radio-frequency package with overmold structure | Howard E. Chen | 2021-09-21 |
| 11088064 | Fine pitch copper pillar package and method | David McCann, John McCormick, Louis W. Nicholls | 2021-08-10 |
| 11069978 | Method of manufacturing a radio-frequency module with a conformal shield antenna | Dinhphuoc Vu Hoang, Anthony James LoBianco, Lori Ann DeOrio, Hoang Mong Nguyen, Ki Wook Lee +4 more | 2021-07-20 |
| 10980106 | Apparatus related to conformal coating implemented with surface mount devices | Anthony James LoBianco, Howard E. Chen, Hoang Mong Nguyen, Matthew Sean Read, Lori Ann DeOrio | 2021-04-13 |
| 10770312 | Under-fill deflash for a dual-sided ball grid array package | — | 2020-09-08 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2020-07-14 |
| 10636717 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2020-04-28 |
| 10607944 | Dual-sided radio-frequency package with overmold structure | Howard E. Chen | 2020-03-31 |
| 10593565 | Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array package | — | 2020-03-17 |