Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12407315 | Stacked filter package having multiple types of acoustic wave devices | Atsushi Takano, Mitsuhiro Furukawa | 2025-09-02 |
| 12375057 | Method of manufacturing a self-shielded acoustic wave device package | Atsushi Takano, Mitsuhiro Furukawa | 2025-07-29 |
| 12301210 | Method of making stacked acoustic wave resonator package with laser-drilled vias | Atsushi Takano, Mitsuhiro Furukawa | 2025-05-13 |
| 12143091 | Methods of plasma dicing bulk acoustic wave components | Atsushi Takano, Mitsuhiro Furukawa | 2024-11-12 |
| 11811385 | Bulk acoustic wave component with conductor extending laterally from via | Atsushi Takano, Mitsuhiro Furukawa | 2023-11-07 |
| 11765814 | Devices and methods related to nested filters | Robert Francis Darveaux, Ki Wook Lee, Sundeep Nand Nangalia, Russ Alan Reisner, John C. Baldwin | 2023-09-19 |
| 11588465 | Stacked temperature compensated acoustic wave device with high thermal conductivity | Hironori Fukuhara, Rei Goto | 2023-02-21 |
| 11581870 | Stacked acoustic wave resonator package with laser-drilled VIAS | Atsushi Takano, Mitsuhiro Furukawa | 2023-02-14 |
| 11496111 | Methods of plasma dicing bulk acoustic wave components | Atsushi Takano, Mitsuhiro Furukawa | 2022-11-08 |
| 11251769 | Bulk acoustic wave components | Atsushi Takano, Mitsuhiro Furukawa | 2022-02-15 |
| 9980371 | Printed wiring board | Takayuki Katsuno, Yuki Ito, Takema Adachi | 2018-05-22 |
| 9917025 | Printed wiring board and method for manufacturing printed wiring board | Kota Noda | 2018-03-13 |
| 9793200 | Printed wiring board | Kota Noda | 2017-10-17 |
| 9723729 | Printed wiring board | Kota Noda | 2017-08-01 |
| 9713267 | Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post | Toru Furuta, Tomoya Terakura | 2017-07-18 |
| 9497849 | Printed wiring board | Takashi Kariya, Toshiki Furutani | 2016-11-15 |
| 9474158 | Printed wiring board | Toshiki Furutani, Keisuke Shimizu, Yuichi Nakamura | 2016-10-18 |
| 9401320 | Combined substrate | Tomoya DAIZO, Takema Adachi, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa +1 more | 2016-07-26 |
| 9368459 | Semiconductor chip with seal ring and sacrificial corner pattern | Noriko Miura, Kinya Goto, Masazumi Matsuura | 2016-06-14 |
| 8975742 | Printed wiring board | Toshiki Furutani | 2015-03-10 |
| 8963291 | Semiconductor chip with seal ring and sacrificial corner pattern | Noriko Miura, Kinya Goto, Masazumi Matsuura | 2015-02-24 |
| 8772648 | Method for manufacturing printed wiring board and printed wiring board | Toshiki Furutani | 2014-07-08 |
| 8513808 | Semiconductor device having trench-isolated element formation region | Katsuhiko Hotta, Toshikazu Matsui, Takuro Homma | 2013-08-20 |
| 8487192 | Printed wiring board and method for manufacturing the same | Masatoshi Kunieda, Kazuhiro Yoshikawa | 2013-07-16 |
| 8365402 | Method for manufacturing printed wiring board | Toshiki Furutani | 2013-02-05 |