Issued Patents All Time
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388025 | Wiring substrate | Masashi KUWABARA | 2025-08-12 |
| 12336095 | Wiring substrate and method for manufacturing wiring substrate | — | 2025-06-17 |
| 12302493 | Wiring substrate | — | 2025-05-13 |
| 12258011 | Vehicle controller and method for controlling vehicle | Yuki Yoshihama, Taiyo Uejima, Yoshinao Takemae | 2025-03-25 |
| 12177975 | Wiring substrate | — | 2024-12-24 |
| 12167535 | Wiring substrate | — | 2024-12-10 |
| 10745819 | Printed wiring board, semiconductor package and method for manufacturing printed wiring board | Yuki Yoshikawa | 2020-08-18 |
| 10645819 | Printed wiring board | Takema Adachi, Toshihide Makino, Yasushi Usami | 2020-05-05 |
| 10271468 | Shield cap and method for manufacturing the same | Takema Adachi, Hidetoshi Noguchi, Shota Tachibana | 2019-04-23 |
| 10231369 | Shield cap and method for manufacturing the same | Takema Adachi, Hidetoshi Noguchi, Shota Tachibana | 2019-03-12 |
| 10231336 | Printed wiring board for mounting electronic component | Takema Adachi, Toshihide Makino, Hidetoshi Noguchi | 2019-03-12 |
| 10194569 | Shield cap and method for manufacturing the same | Takema Adachi, Hidetoshi Noguchi, Shota Tachibana | 2019-01-29 |
| 10182518 | Shield cap and method for manufacturing the same | Takema Adachi, Hidetoshi Noguchi, Shota Tachibana | 2019-01-15 |
| 10098243 | Printed wiring board and semiconductor package | Yuki Yoshikawa | 2018-10-09 |
| 10070523 | Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same | Shunsuke Sakai, Kosuke Ikeda, Takema Adachi, Takayuki Katsuno | 2018-09-04 |
| 9951434 | Printed wiring board, semiconductor package and method for manufacturing printed wiring board | Yuki Yoshikawa | 2018-04-24 |
| 9883592 | Wiring board and method for manufacturing the same | Yukinobu Mikado, Toyotaka Shimabe, Shinobu Kato | 2018-01-30 |
| 9859221 | Multilayer wiring board with built-in electronic component | Toyotaka Shimabe, Shunsuke Sakai | 2018-01-02 |
| 9854669 | Package substrate | Yasushi Inagaki | 2017-12-26 |
| 9807885 | Wiring board with built-in electronic component and method for manufacturing the same | Kenji Sakai, Tomoyuki Ikeda | 2017-10-31 |
| 9655249 | Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor | Toyotaka Shimabe, Masahiro Kaneko, Takeshi Tashima, Yasuyuki Shimada, Naoki Shimizu | 2017-05-16 |
| 9655242 | Printed wiring board | Yasushi Inagaki | 2017-05-16 |
| 9601422 | Printed wiring board, semiconductor package, and method for manufacturing printed wiring board | Yuki Yoshikawa | 2017-03-21 |
| 9564392 | Printed wiring board and semiconductor package | Shunsuke Sakai, Yasushi Inagaki | 2017-02-07 |
| 9536801 | Electronic component having encapsulated wiring board and method for manufacturing the same | Daiki Komatsu, Nobuya Takahashi | 2017-01-03 |