Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033927 | Method for manufacturing wiring substrate | Isao Ohno, Yoji Sawada, Kazuhiko Kuranobu | 2024-07-09 |
| 11935822 | Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate | Isao Ohno, Yoji Sawada, Kazuhiko Kuranobu | 2024-03-19 |
| 11622446 | Wiring substrate | Isao Ohno, Yoji Sawada, Kazuhiko Kuranobu | 2023-04-04 |
| 9401320 | Combined substrate | Takema Adachi, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa +1 more | 2016-07-26 |