Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033927 | Method for manufacturing wiring substrate | Isao Ohno, Tomoya DAIZO, Yoji Sawada | 2024-07-09 |
| 11935822 | Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate | Isao Ohno, Tomoya DAIZO, Yoji Sawada | 2024-03-19 |
| 11749444 | Inductor built-in substrate | Hiroaki Kodama, Kazuro Nishiwaki, Hiroaki Uno | 2023-09-05 |
| 11622446 | Wiring substrate | Isao Ohno, Tomoya DAIZO, Yoji Sawada | 2023-04-04 |
| 11521786 | Inductor built-in substrate | Hiroaki Kodama, Kazuro Nishiwaki, Hiroaki Uno | 2022-12-06 |
| 11501909 | Inductor built-in substrate and method for manufacturing the same | Hiroaki Kodama, Kazuro Nishiwaki, Hiroaki Uno | 2022-11-15 |
| 11322301 | Method for manufacturing inductor built-in substrate | Hiroaki Kodama, Kazuro Nishiwaki, Hiroaki Uno | 2022-05-03 |
| 10818428 | Inductor built-in substrate | Hiroaki Kodama, Kazuro Nishiwaki, Hiroaki Uno | 2020-10-27 |