Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12407315 | Stacked filter package having multiple types of acoustic wave devices | Atsushi Takano, Takeshi Furusawa | 2025-09-02 |
| 12375057 | Method of manufacturing a self-shielded acoustic wave device package | Atsushi Takano, Takeshi Furusawa | 2025-07-29 |
| 12355413 | Cap substrate for acoustic wave device | Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew | 2025-07-08 |
| 12308811 | Method of manufacturing a cap substrate for acoustic wave device | Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew | 2025-05-20 |
| 12301210 | Method of making stacked acoustic wave resonator package with laser-drilled vias | Atsushi Takano, Takeshi Furusawa | 2025-05-13 |
| 12143091 | Methods of plasma dicing bulk acoustic wave components | Atsushi Takano, Takeshi Furusawa | 2024-11-12 |
| 12135510 | Developing apparatus | Tomoyuki Sakamaki | 2024-11-05 |
| 11835883 | Image forming apparatus capable of reducing periodic image density unevenness | Tomoyuki Sakamaki | 2023-12-05 |
| 11811385 | Bulk acoustic wave component with conductor extending laterally from via | Atsushi Takano, Takeshi Furusawa | 2023-11-07 |
| 11774883 | Image forming apparatus that executes a mode for driving each of conveyance member and developer carrying member without executing image forming operation | Masahiro Ootsuka, Shunichi Takada, Tatsuya Inoue | 2023-10-03 |
| 11581870 | Stacked acoustic wave resonator package with laser-drilled VIAS | Atsushi Takano, Takeshi Furusawa | 2023-02-14 |
| 11567426 | Developing apparatus | Tomoyuki Sakamaki | 2023-01-31 |
| 11545952 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2023-01-03 |
| 11496111 | Methods of plasma dicing bulk acoustic wave components | Atsushi Takano, Takeshi Furusawa | 2022-11-08 |
| 11251769 | Bulk acoustic wave components | Atsushi Takano, Takeshi Furusawa | 2022-02-15 |
| 11243483 | Developing apparatus | Tomoyuki Sakamaki | 2022-02-08 |
| 10999932 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2021-05-04 |
| 10852661 | Developing apparatus | Tomoyuki Sakamaki | 2020-12-01 |
| 10725397 | Developing apparatus | Tomoyuki Sakamaki | 2020-07-28 |
| 10599095 | Image forming apparatus | Kyosuke Takahashi, Hideki Fujita, Akihiro Noguchi, Kosuke Takeuchi | 2020-03-24 |
| 10574202 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2020-02-25 |
| 10321572 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2019-06-11 |
| 10075146 | Elastic wave device with sealing structure | Yosuke Hamaoka, Toru Yamaji | 2018-09-11 |
| 9846392 | Developing device for preventing density unevenness and developer overflow | Akihiro Noguchi | 2017-12-19 |
| 9760037 | Developing apparatus | Tomoyuki Sakamaki | 2017-09-12 |