Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545952 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Mitsuhiro Furukawa, Ichiro Kameyama | 2023-01-03 |
| 10999932 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Mitsuhiro Furukawa, Ichiro Kameyama | 2021-05-04 |
| 10574202 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Mitsuhiro Furukawa, Ichiro Kameyama | 2020-02-25 |
| 10321572 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Mitsuhiro Furukawa, Ichiro Kameyama | 2019-06-11 |
| 8318548 | Method for manufacturing semiconductor device | Kunihiro Yamashita, Kazushi Hatauchi | 2012-11-27 |
| 7028397 | Method of attaching a semiconductor chip to a chip mounting substrate | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2006-04-18 |
| 6995468 | Semiconductor apparatus utilizing a preparatory stage for a chip assembly | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2006-02-07 |
| 6965154 | Semiconductor device | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2005-11-15 |
| 6867507 | Lead frame | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2005-03-15 |
| 6784021 | Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2004-08-31 |
| 6737736 | Semiconductor device | Shunichi Abe, Naoki Izumi, Akira Yamazaki | 2004-05-18 |