Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294615 | Using a requestor identity to enforce a security policy on a network connection that conforms to a shared-access communication protocol | Or MORAN, Meital BEN DAVID | 2025-05-06 |
| 12244564 | Security for computer systems | Daniel Lahiano, Orr Moran | 2025-03-04 |
| 12009343 | Stackable package and method | Robert Francis Darveaux, Roger D. St. Amand | 2024-06-11 |
| 10821645 | Device for deformational processing of materials (variants) | Lev Anatolyevich Gubenko | 2020-11-03 |
| 10220560 | Device for extruding plasticized masses and plastic powdered materials | Lev Anatolyevich Gubenko | 2019-03-05 |
| 9496210 | Stackable package and method | Robert Francis Darveaux, Roger D. St. Amand | 2016-11-15 |
| 8482134 | Stackable package and method | Robert Francis Darveaux, Roger D. St. Amand | 2013-07-09 |
| 8084868 | Semiconductor package with fast power-up cycle and method of making same | Roger D. St. Amand | 2011-12-27 |
| 8072083 | Stacked electronic component package having film-on-wire spacer | Roger D. St. Amand, ChangSuk Han, YounSang Kim, KyungRok Park | 2011-12-06 |
| 7859119 | Stacked flip chip die assembly | Roger D. St. Amand | 2010-12-28 |
| 7768135 | Semiconductor package with fast power-up cycle and method of making same | Roger D. St. Amand | 2010-08-03 |
| 7675180 | Stacked electronic component package having film-on-wire spacer | Roger D. St. Amand, ChangSuk Han, YounSang Kim, KyungRok Park | 2010-03-09 |
| 7459776 | Stacked die assembly having semiconductor die projecting beyond support | Roger D. St. Amand | 2008-12-02 |
| 7132753 | Stacked die assembly having semiconductor die overhanging support | Roger D. St. Amand | 2006-11-07 |
| 7071568 | Stacked-die extension support structure and method thereof | Roger D. St. Amand, Intae Kim | 2006-07-04 |
| 6930378 | Stacked semiconductor die assembly having at least one support | Roger D. St. Amand | 2005-08-16 |
| 5767480 | Hole generation and lead forming for integrated circuit lead frames using laser machining | Noah L. Anglin, Nick Bacile | 1998-06-16 |