Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Jie Bai, Ly Do, Hung The Chau, Julissa Eckenrode | 2021-02-09 |
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Qiaohong Huang, Hong Jiang, Youko Murata, Yusuke Horiguchi +1 more | 2019-03-26 |
| 9362105 | Pre-cut wafer applied underfill film on dicing tape | Gina Hoang, Rose Guino | 2016-06-07 |
| 9281182 | Pre-cut wafer applied underfill film | Gina Hoang, Rose Guino | 2016-03-08 |
| 9082840 | Coating adhesives onto dicing before grinding and micro-fabricated wafers | Hwang Kyu Yun, Jeffrey W. Leon, Raj Peddi | 2015-07-14 |
| 8753959 | Coating adhesives onto dicing before grinding and micro-fabricated wafers | Hwang Kyu Yun, Jeffrey W. Leon, Raj Peddi | 2014-06-17 |
| 8072083 | Stacked electronic component package having film-on-wire spacer | Roger D. St. Amand, ChangSuk Han, KyungRok Park, Vladimir Perelman | 2011-12-06 |
| 7675180 | Stacked electronic component package having film-on-wire spacer | Roger D. St. Amand, ChangSuk Han, KyungRok Park, Vladimir Perelman | 2010-03-09 |