Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927249 | Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof | Jie Bai | 2021-02-23 |
| 10913879 | Thermally conductive pre-applied underfill formulations and uses thereof | Jie Bai, Hung The Chau, YounSang Kim, Julissa Eckenrode | 2021-02-09 |