Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12187843 | Liquid compression molding or encapsulant compositions | Jay Chao, Rong Zhang | 2025-01-07 |
| 9865551 | Methods to control wafer warpage upon compression molding thereof and articles useful therefor | Tadashi Takano | 2018-01-09 |
| 9780068 | Adhesive for electronic component | Sugiura Yoko, Horiguchi Yusuke, Mieko Sano | 2017-10-03 |
| 9449938 | Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof | Pukun Zhu, Shashi Gupta, Andrew Christopher Laib | 2016-09-20 |
| 9362105 | Pre-cut wafer applied underfill film on dicing tape | YounSang Kim, Rose Guino | 2016-06-07 |
| 9305892 | Adhesive for electronic component | Sugiura Yoko, Horiguchi Yusuke, Mieko Sano | 2016-04-05 |
| 9281182 | Pre-cut wafer applied underfill film | YounSang Kim, Rose Guino | 2016-03-08 |
| 9200184 | Chain extended epoxy to improve adhesion of conductive die attach film | Junbo Gao | 2015-12-01 |
| 8378017 | Thermosetting adhesive compositions | Stephen M. Dershem, Melin Lu | 2013-02-19 |
| 6750301 | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups | Mark Richard Bonneau, Yun Kil Shin, Martin Sobczak | 2004-06-15 |