Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12274006 | Printed circuit board with mold adhesion boundary for die attach pad | — | 2025-04-08 |
| 9449938 | Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof | Pukun Zhu, Gina Hoang, Shashi Gupta | 2016-09-20 |