Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394699 | Semiconductor devices and methods of manufacturing semiconductor devices | Louis W. Nicholls | 2025-08-19 |
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2024-12-03 |
| 12051611 | Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby | Young Do Kweon | 2024-07-30 |
| 12009343 | Stackable package and method | Robert Francis Darveaux, Vladimir Perelman | 2024-06-11 |
| 11876039 | Semiconductor devices and methods of manufacturing semiconductor devices | Louis W. Nicholls | 2024-01-16 |
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2023-05-16 |
| 11621243 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2023-04-04 |
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2022-11-01 |
| 11362027 | Semiconductor devices and methods of manufacturing semiconductor devices | Louis W. Nicholls | 2022-06-14 |
| 11018040 | Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby | Young Do Kweon | 2021-05-25 |
| 10943858 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2021-03-09 |
| 10818637 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2020-10-27 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2020-07-14 |
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2019-07-09 |
| 10242966 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2019-03-26 |
| 10192816 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2019-01-29 |
| 9852976 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2017-12-26 |
| 9721872 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2017-08-01 |
| 9543242 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2017-01-10 |
| 9496210 | Stackable package and method | Robert Francis Darveaux, Vladimir Perelman | 2016-11-15 |
| 8890337 | Column and stacking balls package fabrication method and structure | — | 2014-11-18 |
| 8836115 | Stacked inverted flip chip package and fabrication method | August Joseph Miller, Jr., Alexander William Copia, KwangSeok Oh | 2014-09-16 |
| 8796561 | Fan out build up substrate stackable package and method | Christopher M. Scanlan, Jae Dong Kim | 2014-08-05 |
| 8704369 | Flip chip bump structure and fabrication method | Ronald Patrick Huemoeller, Robert Francis Darveaux | 2014-04-22 |
| 8633598 | Underfill contacting stacking balls package fabrication method and structure | — | 2014-01-21 |