Issued Patents All Time
Showing 25 most recent of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Curtis Zwenger | 2024-12-31 |
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2024-12-03 |
| 12141320 | Secure permissioning of access to user accounts, including secure distribution of aggregated user account data | William Hockey, Joy Zheng, Baker Shogry | 2024-11-12 |
| 12136565 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2024-11-05 |
| 12040305 | Shielded electronic component package | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2024-07-16 |
| 12021854 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2024-06-25 |
| 11901335 | Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch | Ronald Patrick Huemoeller, David Jon Hiner | 2024-02-13 |
| 11803660 | Secure permissioning of access to user accounts, including secure distribution of aggregated user account data | William Hockey, Joy Zheng, Baker Shogry | 2023-10-31 |
| 11676941 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, In Su Mok, Sang Hyoun Lee, Won Chul Do +1 more | 2023-06-13 |
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2023-05-16 |
| 11646290 | Shielded electronic component package | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2023-05-09 |
| 11595374 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2023-02-28 |
| 11503010 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2022-11-15 |
| 11424155 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2022-08-23 |
| 11289451 | Semiconductor package with high routing density patch | Ronald Patrick Huemoeller, David Jon Hiner | 2022-03-29 |
| 11120158 | Secure permissioning of access to user accounts, including secure distribution of aggregated user account data | William Hockey, Joy Zheng, Baker Shogry | 2021-09-14 |
| 11050729 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2021-06-29 |
| 11031366 | Shielded electronic component package | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2021-06-08 |
| 11031256 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Curtis Zwenger | 2021-06-08 |
| 10943858 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2021-03-09 |
| 10904239 | Secure permissioning of access to user accounts, including secure deauthorization of access to user accounts | William Hockey | 2021-01-26 |
| 10784232 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller | 2020-09-22 |
| 10748786 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Curtis Zwenger | 2020-08-18 |
| 10714378 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2020-07-14 |
| 10672740 | Semiconductor package with high routing density patch | Ronald Patrick Huemoeller, David Jon Hiner | 2020-06-02 |