Issued Patents All Time
Showing 51–75 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | David Jon Hiner, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2016-09-06 |
| 9433117 | Shield lid interconnect package and method | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2016-08-30 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2016-05-24 |
| 9136159 | Method and system for a semiconductor for device package with a die-to-packaging substrate first bond | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2015-09-15 |
| 9129943 | Embedded component package and fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2015-09-08 |
| 9122885 | Creating distinct user spaces through user identifiers | Philip Schentrup, Eoin Hyden | 2015-09-01 |
| 9100390 | Method and system for enrolling and authenticating computing devices for data usage accounting | James Asnis, Matthew John Peterson | 2015-08-04 |
| 9082833 | Through via recessed reveal structure and method | David Jon Hiner, Ronald Patrick Huemoeller | 2015-07-14 |
| 9048298 | Backside warpage control structure and fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2015-06-02 |
| 9040349 | Method and system for a semiconductor device package with a die to interposer wafer first bond | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2015-05-26 |
| 8987050 | Method and system for backside dielectric patterning for wafer warpage and stress control | David Jon Hiner, Ronald Patrick Huemoeller | 2015-03-24 |
| 8856959 | Creating distinct user spaces through user identifiers | Philip Schentrup, Eoin Hyden | 2014-10-07 |
| 8802499 | Methods for temporary wafer molding for chip-on-wafer assembly | David Jon Hiner, Ronald Patrick Huemoeller | 2014-08-12 |
| 8796072 | Method and system for a semiconductor device package with a die-to-die first bond | Ronald Patrick Huemoeller, Won Chul Do | 2014-08-05 |
| 8650658 | Creating distinct user spaces through user identifiers | Philip Schentrup, Eoin Hyden | 2014-02-11 |
| 8508023 | System and method for lowering contact resistance of the radio frequency (RF) shield to ground | John Cambas, Francis Tan, Pam Montero | 2013-08-13 |
| 8390130 | Through via recessed reveal structure and method | David Jon Hiner, Ronald Patrick Huemoeller | 2013-03-05 |
| 8199518 | Top feature package and method | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2012-06-12 |
| 7868472 | Thermal dissipation in integrated circuit systems | — | 2011-01-11 |
| 7859116 | Exposed metal bezel for use in sensor devices and method therefor | Christopher J. Berry, Christopher M. Scanlan | 2010-12-28 |
| 7713840 | Electronic components produced by a method of separating two layers of material from one another | Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh | 2010-05-11 |
| 7554194 | Thermally enhanced semiconductor package | Ki Wook Lee, Chang Ho Jang | 2009-06-30 |
| 7537960 | Method of making multi-chip package with high-speed serial communications between semiconductor dice | Paul G. Chenard, Revathi Uma Polisetti, Patrick A. McKinley | 2009-05-26 |
| 7474537 | Circuit board with multiple layer interconnect and method of manufacture | Mark D. Johnson, Jeffrey P. Tobin, William H. Sisson | 2009-01-06 |
| 7359198 | System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry | Mark D. Johnson, William H. Sisson, Jeffrey P. Tobin | 2008-04-15 |