MK

Michael Kelly

AT Amkor Technology: 39 patents #12 of 595Top 3%
AP Amkor Technology Singapore Holding Pte.: 13 patents #15 of 289Top 6%
VI Visa: 12 patents #142 of 2,009Top 8%
AP Avago Technologies General Ip (Singapore) Pte.: 6 patents #139 of 2,004Top 7%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
TL Thomson Licensing: 2 patents #947 of 2,575Top 40%
CO Conwed: 2 patents #2 of 26Top 8%
OG Osram Gmbh: 2 patents #314 of 946Top 35%
TE Thomson Consumer Electronics: 2 patents #159 of 436Top 40%
HP HP: 1 patents #3,612 of 7,018Top 55%
AP Avago Technologies General Ip Pte.: 1 patents #18 of 125Top 15%
PI Pion: 1 patents #6 of 15Top 40%
DL Draper Laboratory: 1 patents #495 of 921Top 55%
AT Agilent Technologies: 1 patents #1,723 of 3,411Top 55%
📍 Queen Creek, AZ: #1 of 206 inventorsTop 1%
🗺 Arizona: #149 of 32,909 inventorsTop 1%
Overall (All Time): #17,158 of 4,157,543Top 1%
92
Patents All Time

Issued Patents All Time

Showing 76–92 of 92 patents

Patent #TitleCo-InventorsDate
7342310 Multi-chip package with high-speed serial communications between semiconductor die Paul Chenard, Revathi Uma Polisetti, Patrick A. McKinley 2008-03-11
7341925 Method for transferring a semiconductor body from a growth substrate to a support material Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh 2008-03-11
7262508 Integrated circuit incorporating flip chip and wire bonding Ravindhar K. Kaw 2007-08-28
7202546 Integrated circuit with copper interconnect and top level bonding/interconnect layer Salvador Salcido, Michael D. Cusack, Ravindhar K. Kaw 2007-04-10
6974758 Method of producing a light-emitting diode Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh 2005-12-13
6795903 System and method for searching for duplicate data Mark Alan Schultz, Shu Lin 2004-09-21
6740604 Method of separating two layers of material from one another Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh 2004-05-25
6559075 Method of separating two layers of material from one another and electronic components produced using this process Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh 2003-05-06
6442255 Automatic subscriber callback system Robert Alan Pitsch, Suresh Vishwanath Leley 2002-08-27
6396116 Integrated circuit packaging for optical sensor devices James Chang, Gary Sasser, Andrew Hunter, Cheng-Cheng Chang 2002-05-28
6064724 Modem with automatic callback provisions 2000-05-16
5798567 Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors Pirooz Emad 1998-08-25
5787101 Smart card message transfer without microprocessor intervention 1998-07-28
5251825 Method and apparatus for comminuting and decontaminating waste material Thomas J. Dumaine, John KENNETT 1993-10-12
5005823 Corner alignment system Donald C. Fyler, Edward Van Duyne 1991-04-09
4332326 Plastic netting for load unitization Eugene R. Pastien 1982-06-01
4208457 Plastic netting for load unitization Eugene R. Pastien 1980-06-17