| 9986639 |
Vertical magnetic barrier for integrated electronic module and related methods |
Aldrick S. Limjoco, Donal O'Sullivan, Patrick J. Meehan, Thomas Conway |
2018-05-29 |
| D728093 |
Enteral feeding device |
Renae Moomjian, Karl Sprague, James Nelson, Richard G. Swanson, Lawrence Trujillo |
2015-04-28 |
| 8269334 |
Multichip package leadframe including electrical bussing |
— |
2012-09-18 |
| 8039318 |
System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices |
Randall D. Briggs |
2011-10-18 |
| 8021928 |
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
Randall D. Briggs |
2011-09-20 |
| 7977773 |
Leadframe including die paddle apertures for reducing delamination |
— |
2011-07-12 |
| 7902655 |
Multichip package leadframe including electrical bussing |
— |
2011-03-08 |
| 7800205 |
Quad flat pack (QFP) package and flexible power distribution method therefor |
Thomas Omega Wheless, Jr., Randall D. Briggs |
2010-09-21 |
| 7745263 |
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
Randall D. Briggs |
2010-06-29 |
| 7629675 |
System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices |
Randall D. Briggs |
2009-12-08 |
| 7495320 |
System and method for providing a power bus in a wirebond leadframe package |
— |
2009-02-24 |
| 7446677 |
Method and apparatus for optically detecting selections made on an input device |
Steven F. Wald |
2008-11-04 |
| 7443011 |
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
Randall D. Briggs |
2008-10-28 |
| 7202546 |
Integrated circuit with copper interconnect and top level bonding/interconnect layer |
Salvador Salcido, Michael Kelly, Ravindhar K. Kaw |
2007-04-10 |
| 4959706 |
Integrated circuit having an improved bond pad |
Michael Hagen, James E. Larkin |
1990-09-25 |
| 4875138 |
Variable pitch IC bond pad arrangement |
— |
1989-10-17 |
| 4753820 |
Variable pitch IC bond pad arrangement |
— |
1988-06-28 |
| 4730160 |
Programmable thermal emulator test die |
Christopher A. Freymuth |
1988-03-08 |
| 4711700 |
Method for densifying leadframe conductor spacing |
— |
1987-12-08 |
| 4463892 |
Method for manufacturing IC packages |
Kenneth B. Turnbaugh |
1984-08-07 |
