Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9986639 | Vertical magnetic barrier for integrated electronic module and related methods | Aldrick S. Limjoco, Donal O'Sullivan, Patrick J. Meehan, Thomas Conway | 2018-05-29 |
| D728093 | Enteral feeding device | Renae Moomjian, Karl Sprague, James Nelson, Richard G. Swanson, Lawrence Trujillo | 2015-04-28 |
| 8269334 | Multichip package leadframe including electrical bussing | — | 2012-09-18 |
| 8039318 | System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices | Randall D. Briggs | 2011-10-18 |
| 8021928 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Randall D. Briggs | 2011-09-20 |
| 7977773 | Leadframe including die paddle apertures for reducing delamination | — | 2011-07-12 |
| 7902655 | Multichip package leadframe including electrical bussing | — | 2011-03-08 |
| 7800205 | Quad flat pack (QFP) package and flexible power distribution method therefor | Thomas Omega Wheless, Jr., Randall D. Briggs | 2010-09-21 |
| 7745263 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Randall D. Briggs | 2010-06-29 |
| 7629675 | System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices | Randall D. Briggs | 2009-12-08 |
| 7495320 | System and method for providing a power bus in a wirebond leadframe package | — | 2009-02-24 |
| 7446677 | Method and apparatus for optically detecting selections made on an input device | Steven F. Wald | 2008-11-04 |
| 7443011 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Randall D. Briggs | 2008-10-28 |
| 7202546 | Integrated circuit with copper interconnect and top level bonding/interconnect layer | Salvador Salcido, Michael Kelly, Ravindhar K. Kaw | 2007-04-10 |
| 4959706 | Integrated circuit having an improved bond pad | Michael Hagen, James E. Larkin | 1990-09-25 |
| 4875138 | Variable pitch IC bond pad arrangement | — | 1989-10-17 |
| 4753820 | Variable pitch IC bond pad arrangement | — | 1988-06-28 |
| 4730160 | Programmable thermal emulator test die | Christopher A. Freymuth | 1988-03-08 |
| 4711700 | Method for densifying leadframe conductor spacing | — | 1987-12-08 |
| 4463892 | Method for manufacturing IC packages | Kenneth B. Turnbaugh | 1984-08-07 |