Michael D. Cusack — 20 Patents at Disney

Michael D. Cusack has been granted 20 US patents while listed as an inventor at Disney. The first was granted in 1984 and the most recent in May 2018. Michael D. Cusack ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Michael D. Cusack in Newmarket on Fergus, CA, IE.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9986639	Vertical magnetic barrier for integrated electronic module and related methods	Aldrick S. Limjoco, Donal O'Sullivan, Patrick J. Meehan, Thomas Conway	2018-05-29	$57,399,000
D728093	Enteral feeding device	Renae Moomjian, Karl Sprague, James Nelson, Richard G. Swanson, Lawrence Trujillo	2015-04-28
8269334	Multichip package leadframe including electrical bussing	—	2012-09-18	$2,453,000
8039318	System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices	Randall D. Briggs	2011-10-18	$6,412,000
8021928	System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices	Randall D. Briggs	2011-09-20	$5,143,000
7977773	Leadframe including die paddle apertures for reducing delamination	—	2011-07-12	$2,771,000
7902655	Multichip package leadframe including electrical bussing	—	2011-03-08	$5,980,000
7800205	Quad flat pack (QFP) package and flexible power distribution method therefor	Thomas Omega Wheless, Jr., Randall D. Briggs	2010-09-21	$18,589,000
7745263	System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices	Randall D. Briggs	2010-06-29	$10,500,000
7629675	System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices	Randall D. Briggs	2009-12-08	$25,983,000
7495320	System and method for providing a power bus in a wirebond leadframe package	—	2009-02-24
7446677	Method and apparatus for optically detecting selections made on an input device	Steven F. Wald	2008-11-04
7443011	System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices	Randall D. Briggs	2008-10-28	$6,661,000
7202546	Integrated circuit with copper interconnect and top level bonding/interconnect layer	Salvador Salcido, Michael Kelly, Ravindhar K. Kaw	2007-04-10
4959706	Integrated circuit having an improved bond pad	Michael Hagen, James E. Larkin	1990-09-25	$2,930,000
4875138	Variable pitch IC bond pad arrangement	—	1989-10-17	$3,805,000
4753820	Variable pitch IC bond pad arrangement	—	1988-06-28	$6,701,000
4730160	Programmable thermal emulator test die	Christopher A. Freymuth	1988-03-08	$5,850,000
4711700	Method for densifying leadframe conductor spacing	—	1987-12-08	$13,036,000
4463892	Method for manufacturing IC packages	Kenneth B. Turnbaugh	1984-08-07	$5,654,000

Michael D. Cusack — 20 Patents

Issued Patents All Time

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